SiTune and MixComm are collaborating to develop 5G mmWave reference designs.
The designs will be based on SiTune’s IceWings RF transceiver and MixComm’s mmWave solutions including the Summit2629 Beamformer Front End IC and the Eclipse3741 Antenna in Package, which was recently unveiled.
The collaboration will allow customers to develop systems that maximise performance and thermal efficiency but with an optimal bill of materials and fast time to market. Initial reference designs from both will be ideal for 5G O-ran infrastructure such as small cells and customer premises equipment.
SiTune CEO Vahid Toosi is excited to work with MixComm to provide solutions in the 5G O-ran infrastructure segment.
MixComm CEO Mike Noonen says MixComm is thrilled to work with SiTune, adding that "it is the ideal partner to help reduce the complexity and time to market for 5G solutions."
SiTune IceWings highlights:
Lower power consumption: Accelerate the deployment of 5G networks by leveraging new low power technology perfect for energy efficient infrastructure systems including Radio Unit (RU), small cell, gNodeB and CPE.
Sub-6 and mmWave convergence: Ultimate hardware design flexibility and novel architecture leading to a single pluggable chip converging sub-7GHz bands including CBRS (Citizens Broadband Radio Service) and LTE bands with mmWave IF transceiver solution.
Multi-standard interface: Applicable to a wide range of wireless standards due to a scalable RF interface supporting RF frequencies of 600MHz to 7.2GHz.
High-performance solutions: Complying with 5G NR, Wi-Fi 6/6E and 4G LTE specifications and offering performance when it comes to signal quality, noise, linearity, and power consumption as well as supporting Digital Pre-Distortion (DPD) algorithms due to architecture.
Scalable support: Supports various high-bandwidth 5G applications including gNodeB, private networks, Enterprise CPE, IoT Edge Compute, and Small Cells.
MixComm Summit2629 highlights:
Efficiency
Four-element Dual-pol. TX/RX with independent polarisation beam directions
CMOS power amplifiers
Low-noise amplifiers and low-loss T/R switching
Transmit and receive-mode power consumption
Extensive on-chip temperature and power sensing
SPI with large on-chip beam table storage
Wafer-level chip-scale package (WLCSP) compatible with PCB manufacturing
Support for large-scale arrays through multiple chip-addressing modes
MixComm Eclipse3741 highlights:
Sixteen-element dual polarisation
Phased array antenna module
Optimised for tiling multiple Eclipse modules together for larger arrays
Full TX/RX TDD beam forming RF chains
TX and RX power consumption
Stacked SOI CMOS PAs
T/R switches for TDD applications
Independent dual polarisation beam directions
2048-entry on-chip Beam Table Storage
Antenna in Package (AiP) BGA Module 15mm x 15mm
Reference designs from this collaboration will be made available in 2H21.
