MediaTek has launched a new mid-range 5G chipset in its Dimensity series. The new chipset is called Dimensity 900 and it is built upon a 6nm process, which is the same fabrication process used to build the flagship Dimensity 1200 SoC. MediaTek claims the fabrication process makes it 8 percent more efficient than the 7nm SoCs like the Dimensity 820 SoC.

The newest MediaTek Dimensity 900 chipset holds an octa-core configuration, where there are two new Cortex-A78 cores clocked at 2.4GHz and six Cortex-A55 cores at up to 2GHz. The latest processor for mid-range phones also sports an ARM Mali-G68 MC4 GPU.

The MediaTek Dimensity 900 SoC supports sub-6GHz 5G, with still no mmWave support (flagship Dimensity 1200 SoC also doesn’t support) with peak download speeds of 2.77Gbps. Other connectivity options include 5G+5G dual SIM support, Wi-Fi 6, and Bluetooth 5.2 capabilities. In terms of camera functionality, the MediaTek Dimensity 900 offers support for 108MP single cameras, 20+20MP dual camera, up to four concurrent cameras, with 4K HDR, and 4K/30fps shooting support.

The all-new Dimensity 900 SoC supports LPDDR5 RAM, UFS 3.1 storage standard, and 3^rd-gen MediaTek APU. It supports a maximum display resolution of 2,520x1080 pixels, a maximum refresh rate of 120Hz, HDR10+ support, and support for the AV1 codec.

The first phones with MediaTek Dimensity 900 processor are expected to launch in the global market in Q2 2021. This means we may see them coming as soon as the next few weeks.