Asus Zenfone 8 and Zenfone 8 Flip's specs and renders leak
Asus will introduce the Zenfone 8 series on May 12, and less than a week ahead of the unveiling, specifications and renders of the Zenfone 8 and Zenfone 8 Flip have leaked, painting a clearer picture of the lineup.
Asus Zenfone 8 Flip
The Zenfone 8 Flip will pack a 6.67" FullHD+ 90Hz AMOLED screen with no notch or punch hole, and it will likely have a fingerprint reader underneath for biometric authentication.
The smartphone will be powered by the Snapdragon 888 SoC and have 8GB RAM and 256GB storage onboard. It will ship with a 5,000 mAh battery that will charge at up to 30W.
The Zenfone 8 Flip will come in two colors and will weigh 230 grams.
Asus Zenfone 8
The Zenfone 8 is expected to be the "Mini" model in the lineup since it will sport a 5.92" FullHD+ screen. And unlike the Flip, the regular variant will have a punch hole in the top-left corner of the display for the selfie camera.
The rear panel of the Zenfone 8 will feature a rectangular camera island housing a LED flash and two shooters - 64MP main and 12MP macro. The smartphone will also record 8K videos.
The source claims that the Zenfone 8 will have a Snapdragon 888 under the hood paired with 8GB RAM and 128GB storage. But we've heard of 6GB, 12GB, and 16GB RAM, and 256GB storage as well. That said, fueling the entire package will be a 4,000 mAh battery charged through a USB-C port at up to 30W.
The Zenfone 8 will also come with the 3.5mm headphone jack located at the top. The smartphone will weigh 170 grams and have two color options.
Reader comments
I hope the leaks are fake and the flip version has 3.5mm jack and 120hz display.
That's not how it works. That chin has screen components. You (probably) can't put a selfie cam in there or else it would've already been done and it probably had been with the Xperia 10.
- Anonymous
- 04X
Yihaa, a more compagt phone with high end hardware. A little too heavy but it may be may new phone.