Taiwan IC substrate suppliers gearing up for mmWave AiP modules
Jay Liu, Taipei; Willis Ke, DIGITIMES

Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages) modules for 5G mmWave smartphones in 2021, according to industry sour...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.