Summary
Market Segment as follows:
By Region
AsiaPacific
North America
Europe
South America
Middle East Africa
By Type
Urea Formaldehyde Resin Powder
Urea Formaldehyde Resin Solution
By Application
LED Lighting
Automotive Electronics
Power Electronics
Telecommunication IT
Others
By Company
Dow Corning Corporation US
3M Company US
ParkerHannifin Corporation US
Wacker Chemie AG Germany
Henkel AG Co. KGaA Germany
Lord Corporation US
Electrolube UK
Momentive Performance Materials Inc. US
Laird PLC US
ShinEtsu MicroSi, Inc US
ACC Silicones
AOS Thermal Compounds
OMEGA Engineering Inc.
Polymatech Japan Co., Ltd.
Intertronics
Nusil Technology LLC
Microtech Components GmbH
Aremco Products Inc.
M.G. Chemicals
Novagard Solutions Inc.
Dupont
Kerafol Keramische Folien GmbH
Fujipoly
WakefieldVette, Inc.
Zalman Tech Co., Ltd.
The main contents of the report including:
Section 1:
Product definition, type and application, global and regional market overview;
Section 2:
Global and regional Market competition by company;
Section 3:
Global and regional sales revenue, volume and price by type;
Section 4:
Global and regional sales revenue, volume and price by application;
Section 5:
Regional export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.
Original Article: Global Electronic Thermal Interface Materials Market Research Report 2018 [Report Updated: 08032018] Prices from USD $3500
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