Summary
In integrated circuit packaging, a solder ball, also a solder bump often referred to simply as "ball" or "bumps" is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions.
Market Segment as follows:
By Region / Countries
North America U.S., Canada, Mexico
Europe Germany, U.K., France, Italy, Russia, Spain etc
South America Brazil, Argentina etc
Middle East Africa Saudi Arabia, South Africa etc
By Type
Lead Solder Ball
Lead Free Solder Ball
By EndUser / Application
BGA
CSP WLCSP
FlipChip Others
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Original Article: 20152023 World Solder Ball Market Research Report by Product Type, EndUser / Application and Regions / Countries [Report Updated: 22012018] Prices from USD $2800
NEXT ARTICLE