Summary
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions.
Market Segment as follows:
By Region / Countries
North America U.S., Canada, Mexico
Europe Germany, U.K., France, Italy, Russia, Spain etc
South America Brazil, Argentina etc
Middle East Africa Saudi Arabia, South Africa etc
By Type
Silicones
Epoxy
Polyurethane
Others
By EndUser / Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
By Company
Dow Corning
Henkel
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
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